第十届信息技术与教育国际研讨会(cite 2021)宣传图
第十届信息技术与教育国际研讨会(cite 2021)将于2021年3月26-28日在厦门举行。本次会议旨在为业内专家学者分享技术进步和业务经验,聚焦信息技术与教育等领域的前沿研究,提供一个交流的平台。会议将集聚来自世界各地的科研人员、工程师、学者及业界专家,展示他们的最新研究成果及应用。我们谨代表组委会诚邀您同聚厦门,共襄盛会。
温馨提示:该会是学术会议,大会官方语言是英语,无同声传译。会议详情日程请联系客服获取。
该会议征文涉及领域包括(但不限于):collaborative and group learninganalysis and modeling of group interactionsblog culture and its impact on educationcommunities of learners, communities of practicedesign principles for collaborative learninggroup learning environmentnetworked learning communities
evaluating of teaching and learning technologiesassessing the use of technology in learningevaluation of e-learning programsperformance technology in education
learning systems platforms and architecturesauthoring tools and assessment toolsdocument management for learningmetadata for learning objects and materialstechnology standards for e-learningweb-based learning platforms
e-learning and knowledge managementblended e-learning, instructional designhuman resource management and developmentinter-disciplinary perspectiveslifelong learning, evaluation of e-learningmentoring and coaching programsorganizational e-learning strategiesquality management of e-learningtheory development, experimental methods
socially informed and instructional designdevelopment and evaluation of learning environmentgrid-based distributed learning and resources environmentinformal learning environmentsmotivation and engagement in learningsocial and cultural dimensions of learningsocial-historical-cultural contexts and identity
modeling and representationinnovative pedagogical modelsknowledge representation and ontologieslearning process models designmodels of learners and facilitatorspolicies for technology implementationprofessional developmenttasks and problem-solving processes
engineering information institute(工程信息研究院)工程信息研究院,是一个国际学术机构,收集与发布最新的国际学术会议信息,促进学术交流和国际合作,每年与美国电气和电子工程师协会(ieee)、汤姆逊公司(thomson)、科学信息研究所(isi)和美国科研出版社(srp)等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。
★ :本平台作为开放的会展会务信息发布平台,所有资讯仅代表作者个人观点,与平台无关。如文章、图片、音频或视频出现侵权、违规及其他不当言论,请提供相关材料,发送到:2794372171@qq.com